Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Norliza Morban, Yong Chern Poh, Khay Chwan Saw, Si Hao Vincent Yeo | 2022-04-05 |
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Sock Chien Tey, Chan Lam Cha, Hoe Jian Chong, Kim Guan Tan, Mei Yong Wang | 2022-01-04 |