Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Si Hao Vincent Yeo | 2022-04-05 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye +4 more | 2022-03-15 |