Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355429 | Electrical interconnect structure with radial spokes for improved solder void control | Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim, Michael Stadler +1 more | 2022-06-07 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |