Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430731 | Semiconductor arrangement and method for producing a semiconductor arrangement | — | 2022-08-30 |
| 11355429 | Electrical interconnect structure with radial spokes for improved solder void control | Paul Armand Asentista Calo, Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim +1 more | 2022-06-07 |