Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355429 | Electrical interconnect structure with radial spokes for improved solder void control | Paul Armand Asentista Calo, Tek Keong Gan, Tien Heng Lem, Fong Lim, Michael Stadler +1 more | 2022-06-07 |