Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11178144 | Apparatus and method by which user device in home network system transmits home-device-related information | Se Hoon Kim, Jai-Ick Chun, Dong-Keon Kong, Eun-Hui Bae | 2021-11-16 |
| 11162164 | Method of producing copper alloy material having high strength and excellent bend ability for automobile and electrical/electronic components | Cheol Min Park, Hyo Moon Nam, Sun Young Mun | 2021-11-02 |
| 11162163 | Method for producing copper-titanium based copper alloy material for automobile and electronic parts and copper alloy material produced therefrom | Cheol Min Park, Hyo Moon Nam, Tae Yang Kwon | 2021-11-02 |
| 11150792 | Method and device for executing object on display | Se-Hee Han, Jack Lee, Joo-yeol Lee, Ji-Hye Lee | 2021-10-19 |
| 11108011 | Flexible display and electronic device including the same | Tae Woo Kim, Han Ul Lee, Jung Kyu Park | 2021-08-31 |
| 11109341 | Position estimation device and method in communication system | Sung Hoon Kim, Hyuk Kwon, Jin Young Hong, Jai-Ick Chun | 2021-08-31 |
| 11091827 | Copper alloy material for automobile and electrical and electronic components and method of producing the same | Cheol Min Park, Hyo Moon Nam | 2021-08-17 |
| 10971379 | Wafer bonding apparatus and wafer bonding system using the same | Sung-Hyup Kim, Tae-Yeong Kim | 2021-04-06 |
| 10950470 | Substrate bonding apparatus and bonding method using the same | Taeyeong Kim, Minsoo Han, Hoonjoo Na, Kwangjin Moon | 2021-03-16 |
| 10915139 | Foldable display | Jin Seo Park | 2021-02-09 |
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Tae-Yeong Kim, Hoe Chul Kim, Hoon-Joo Na, Kwang-Jin Moon | 2021-02-02 |