Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133240 | Semiconductor device and semiconductor package | Hakseung Lee, Jinnam Kim, Eunji Kim, Taeseong Kim, Sangjun Park | 2021-09-28 |
| 11101196 | Semiconductor device including through substrate vias and method of manufacturing the semiconductor device | Myungjoo Park, Jaewon Hwang, Kunsang Park | 2021-08-24 |
| 11004814 | Semiconductor device | Ju-Il Choi, Sujeong Park, Jubin Seo, Jin Ho An, Dong-Chan Lim +1 more | 2021-05-11 |
| 10950470 | Substrate bonding apparatus and bonding method using the same | Taeyeong Kim, Minsoo Han, Jun-Hyung Kim, Hoonjoo Na | 2021-03-16 |