Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950470 | Substrate bonding apparatus and bonding method using the same | Taeyeong Kim, Jun-Hyung Kim, Hoonjoo Na, Kwangjin Moon | 2021-03-16 |
MH
Minsoo Han
Overall (2021): #333,484 of 548,734Top 65%
1
Patents 2021