Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Ju-Il Choi, Pil-Kyu Kang, Hoechul Kim, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 11121131 | Semiconductor device and method of manufacturing the same | Dongsoo Lee, Wonkeun Chung, Suyoung Bae, Jaeyeol Song, Jonghan Lee +2 more | 2021-09-14 |
| 10950470 | Substrate bonding apparatus and bonding method using the same | Taeyeong Kim, Minsoo Han, Jun-Hyung Kim, Kwangjin Moon | 2021-03-16 |
| 10892342 | Semiconductor devices | Wonkeun Chung, Jae-Jung Kim, Jinkyu Jang, Sangyong Kim, Dongsoo Lee +1 more | 2021-01-12 |