Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Pil-Kyu Kang, Hoechul Kim, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 11094612 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Kwang-Jin Moon, Byung-Lyul Park, Jin Ho An, Atsushi Fujisaki | 2021-08-17 |
| 11043445 | Semiconductor device having a through silicon via and methods of manufacturing the same | Ju Bin SEO, Su-Jeong Park, Tae-Seong Kim, Kwang-Jin Moon, Dong-Chan Lim | 2021-06-22 |
| 11018101 | Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices | Kwang-Jin Moon, Ju Bin SEO, Dong-Chan Lim, Atsushi Fujisaki, Ho-Jin Lee | 2021-05-25 |
| 11004814 | Semiconductor device | Kwangjin Moon, Sujeong Park, Jubin Seo, Jin Ho An, Dong-Chan Lim +1 more | 2021-05-11 |