Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133277 | Semiconductor device bonded by bonding pads | Jin-Nam Kim, Tae-Seong Kim, Hoon-Joo Na | 2021-09-28 |
| 11094612 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Byung-Lyul Park, Jin Ho An, Atsushi Fujisaki | 2021-08-17 |
| 11069597 | Semiconductor chips and methods of manufacturing the same | Dae-Suk Lee, Hak Seung Lee, Dong-Chan Lim, Tae-Seong Kim | 2021-07-20 |
| 11043445 | Semiconductor device having a through silicon via and methods of manufacturing the same | Ju Bin SEO, Su-Jeong Park, Tae-Seong Kim, Dong-Chan Lim, Ju-Il Choi | 2021-06-22 |
| 11018101 | Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices | Ju-Il Choi, Ju Bin SEO, Dong-Chan Lim, Atsushi Fujisaki, Ho-Jin Lee | 2021-05-25 |
| 10978655 | Semiconductor devices | Yi Koan Hong, Nae-In Lee, Ho-Jin Lee | 2021-04-13 |
| 10950578 | Semiconductor device, semiconductor package and method of manufacturing the same | Hak Seung Lee, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim | 2021-03-16 |
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Tae-Yeong Kim, Jun-Hyung Kim, Hoe Chul Kim, Hoon-Joo Na | 2021-02-02 |