Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Tae-Yeong Kim, Jun-Hyung Kim, Hoon-Joo Na, Kwang-Jin Moon | 2021-02-02 |
HK
Hoe Chul Kim
Overall (2021): #430,995 of 548,734Top 80%
1
Patents 2021