Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177364 | Integrated circuit device and method of manufacturing the same | Byoung Hoon Lee, Sung-in Suh, Min-Woo Song, Chan Hyeong LEE, Hu-Yong Lee +1 more | 2021-11-16 |
| 11133277 | Semiconductor device bonded by bonding pads | Jin-Nam Kim, Tae-Seong Kim, Kwang-Jin Moon | 2021-09-28 |
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Tae-Yeong Kim, Jun-Hyung Kim, Hoe Chul Kim, Kwang-Jin Moon | 2021-02-02 |