Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10999848 | Sparse-coded ambient backscatter communication method and system | Dong In Kim | 2021-05-04 |
| 10971379 | Wafer bonding apparatus and wafer bonding system using the same | Jun-Hyung Kim, Sung-Hyup Kim | 2021-04-06 |
| 10906283 | Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same | Jun-Hyung Kim, Hoe Chul Kim, Hoon-Joo Na, Kwang-Jin Moon | 2021-02-02 |