Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Ju-Il Choi, Pil-Kyu Kang, Hoechul Kim, Hoonjoo Na, Jaehyung Park | 2021-10-19 |