Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Ju-Il Choi, Pil-Kyu Kang, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 10923452 | Substrate bonding apparatus | Ilyoung Han, Taeyeong Kim, Jihoon Kang, Nohsung Kwak, Seokho Kim +2 more | 2021-02-16 |