Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950470 | Substrate bonding apparatus and bonding method using the same | Minsoo Han, Jun-Hyung Kim, Hoonjoo Na, Kwangjin Moon | 2021-03-16 |
| 10931482 | Method and apparatus for channel estimation in wireless communication system | Jongho OH, Soon Chan Kwon, Daehoon Kim, Jungmin Yoon | 2021-02-23 |
| 10923452 | Substrate bonding apparatus | Ilyoung Han, Jihoon Kang, Nohsung Kwak, Seokho Kim, Hoechul Kim +2 more | 2021-02-16 |