Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11112697 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff +2 more | 2021-09-07 |
| 11114306 | Methods for depositing dielectric material | Bhargav S. Citla, Jethro Tannos, Jingyi Li, Zhong Qiang Hua, Srinivas D. Nemani +1 more | 2021-09-07 |
| 11088005 | Electrostatic chuck having thermally isolated zones with minimal crosstalk | Vijay D. Parkhe, Konstantin Makhratchev, Jason C. Della Rosa, Hamid Noobakhsh, Brad L. Mays | 2021-08-10 |