Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Kai-Hung Yu, Kaoru Maekawa, Robert D. Clark | 2020-12-08 |
| 10734278 | Method of protecting low-K layers | Hirokazu Aizawa, Karthikeyan Pillai, Kandabara Tapily | 2020-08-04 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal, Masanobu Igeta +2 more | 2020-06-30 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu | 2020-03-03 |