Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Nicholas Joy, Kaoru Maekawa, Robert D. Clark | 2020-12-08 |
| 10770479 | Three-dimensional device and method of forming the same | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Jodi Grzeskowiak | 2020-09-08 |
| 10700009 | Ruthenium metal feature fill for interconnects | Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal, Masanobu Igeta +2 more | 2020-06-30 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Nicholas Joy, Gerrit J. Leusink | 2020-03-03 |
| 10541174 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Robert D. Clark | 2020-01-21 |