Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal +2 more | 2020-06-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal +2 more | 2020-06-30 |