Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861739 | Method of patterning low-k materials using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2020-12-08 |
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Kai-Hung Yu, Nicholas Joy, Robert D. Clark | 2020-12-08 |
| 10777456 | Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process | Hirokazu Aizawa | 2020-09-15 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Jeffrey Smith, Nicholas Joy, Gerrit J. Leusink, Kai-Hung Yu | 2020-03-03 |