Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777456 | Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process | Kaoru Maekawa | 2020-09-15 |
| 10734278 | Method of protecting low-K layers | Karthikeyan Pillai, Nicholas Joy, Kandabara Tapily | 2020-08-04 |