Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Kai-Hung Yu, Nicholas Joy, Kaoru Maekawa | 2020-12-08 |
| 10790149 | Method of forming crystallographically stabilized ferroelectric hafnium zirconium based films for semiconductor devices | Kandabara Tapily | 2020-09-29 |
| 10790156 | Atomic layer etching using a boron-containing gas and hydrogen fluoride gas | Kandabara Tapily | 2020-09-29 |
| 10784175 | Platform and method of operating for integrated end-to-end gate contact process | — | 2020-09-22 |
| 10727057 | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process | Richard A. Farrell, Kandabara Tapily, Angelique Raley, Sophie Thibaut | 2020-07-28 |
| 10541174 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu | 2020-01-21 |