Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847424 | Method for forming a nanowire device | Kandabara Tapily, Jeffrey Smith | 2020-11-24 |
| 10833078 | Semiconductor apparatus having stacked gates and method of manufacture thereof | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Subhadeep Kal | 2020-11-10 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal +2 more | 2020-06-30 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Nicholas Joy, Kai-Hung Yu | 2020-03-03 |
| 10541174 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Robert D. Clark, Kai-Hung Yu | 2020-01-21 |