Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770364 | Chip scale package (CSP) including shim die | Hong Shi, Suresh Ramalingam, Siow Chek Tan | 2020-09-08 |
| 10741998 | Thermal-mechanical adjustment for laser system | Sandip Maity, Ying Zhou, David Peter Robinson | 2020-08-11 |
| 10720377 | Electronic device apparatus with multiple thermally conductive paths for heat dissipation | Ho Hyung Lee, Hui-Wen Lin, Henley Liu, Suresh Ramalingam | 2020-07-21 |
| RE48015 | Interconnect devices for electronic packaging assemblies | David Mulford Shaddock, Arun Virupaksha Gowda, John Anthony Vogel, Christian M. Giovanniello | 2020-05-26 |
| 10629512 | Integrated circuit die with in-chip heat sink | Hong-Tsz Pan, Jonathan Chang, Nui Chong, Henley Liu, Suresh Ramalingam | 2020-04-21 |
| 10527670 | Testing system for lid-less integrated circuit packages | Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Myongseob Kim, Ferdinand F. Fernandez +2 more | 2020-01-07 |