TM

Thorsten Meyer

IN Intel: 12 patents #138 of 5,769Top 3%
Infineon Technologies Ag: 3 patents #107 of 980Top 15%
Overall (2019): #3,550 of 560,194Top 1%
15
Patents 2019

Issued Patents 2019

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
10522454 Microelectronic package having a passive microelectronic device disposed within a package body Gerald Ofner, Andreas Wolter, Georg Seidemann, Sven Albers, Christian Geissler 2019-12-31
10453804 Radio die package with backside conductive plate Telesphor Kamgaing 2019-10-22
10394280 Wearable electronic devices and components thereof Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew, Kooi Chi Ooi +1 more 2019-08-27
10373844 Integrated circuit package configurations to reduce stiffness Sven Albers, Sonja Koller, Georg Seidemann, Christian Geissler, Andreas Wolter 2019-08-06
10354925 Semiconductor device including at least one lateral IGFET and at least one vertical IGFET and corresponding manufacturing method Werner Schwetlick 2019-07-16
10319688 Antenna on ceramics for a packaged die Andreas Wolter, Saravana Maruthamuthu, Mikael Bergholz Knudsen, Georg Seidemann, Pablo Herrero +1 more 2019-06-11
10301176 Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) Gerald Ofner, Reinhard Mahnkopf, Christian Geissler, Andreas Augustin 2019-05-28
10290412 Vertical inductor for WLCSP Andreas Wolter, Gerhard Knoblinger 2019-05-14
10249598 Integrated circuit package having wirebonded multi-die stack Pauli Jaervinen, Richard Patten 2019-04-02
10229858 Conductive paths through dielectric with a high aspect ratio for semiconductor devices Andreas Wolter 2019-03-12
10228725 Flexible band wearable electronic device Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler +1 more 2019-03-12
10217695 Connector block with two sorts of through connections, and electronic device comprising a connector block Klaus Pressel, Maciej Wojnowski 2019-02-26
10211182 Package-on-package stacked microelectronic structures Gerald Ofner 2019-02-19
10168391 Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Toni Salminen, Stefan Mieslinger +4 more 2019-01-01
10170409 Package on package architecture and method for making Sanka Ganesan, John S. Guzek, Nitesh Nimkar, Klaus Reingruber 2019-01-01