Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more | 2019-09-10 |
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Zhicheng Ding | 2019-08-27 |
| 10249598 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Pauli Jaervinen | 2019-04-02 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2019-02-19 |