Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Richard Patten | 2019-08-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Richard Patten | 2019-08-27 |