Issued Patents 2019
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510829 | Secondary use of aspect ratio trapping trenches as resistor structures | Alexander Reznicek, Chih-Chao Yang, Oscar van der Straten | 2019-12-17 |
| 10461148 | Multilayer buried metal-insultor-metal capacitor structures | Alexander Reznicek, Joshua M. Rubin, Oscar van der Straten | 2019-10-29 |
| 10453935 | Thermally stable salicide formation for salicide first contacts | Emre Alptekin, Christian Lavoie, Ahmet S. Ozcan | 2019-10-22 |
| 10446746 | ReRAM structure formed by a single process | Alexander Reznicek, Oscar van der Straten, Adra Carr | 2019-10-15 |
| 10431503 | Sacrificial cap for forming semiconductor contact | Zuoguang Liu, Shogo Mochizuki, Jie Yang, Chun Wing Yeung | 2019-10-01 |
| 10431542 | Low resistance seed enhancement spacers for voidless interconnect structures | Joseph F. Maniscalco, Alexander Reznicek, Oscar van der Straten | 2019-10-01 |
| 10410966 | BEOL embedded high density vertical resistor structure | Alexander Reznicek, Oscar van der Straten | 2019-09-10 |
| 10396165 | Thin low defect relaxed silicon germanium layers on bulk silicon substrates | Keith E. Fogel, Alexander Reznicek, Oscar van der Straten | 2019-08-27 |
| 10388721 | Conformal capacitor structure formed by a single process | Alexander Reznicek, Oscar van der Straten | 2019-08-20 |
| 10388600 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Koichi Motoyama | 2019-08-20 |
| 10361277 | Low resistivity wrap-around contacts | Adra Carr, Alexander Reznicek, Oscar van der Straten | 2019-07-23 |
| 10355094 | Low resistance contact structures for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-07-16 |
| 10340355 | Method of forming a dual metal interconnect structure | Hemanth Jagannathan, Koichi Motoyama, Oscar van der Straten | 2019-07-02 |
| 10340221 | Stacked FinFET anti-fuse | Alexander Reznicek, Oscar van der Straten, Keith E. Fogel | 2019-07-02 |
| 10312097 | Salicide bottom contacts | Alexander Reznicek, Oscar van der Straten | 2019-06-04 |
| 10304938 | Maskless method to reduce source-drain contact resistance in CMOS devices | Hemanth Jagannathan, Christian Lavoie | 2019-05-28 |
| 10304841 | Metal FinFET anti-fuse | Alexander Reznicek, Oscar van der Straten, Miaomiao Wang, Chih-Chao Yang | 2019-05-28 |
| 10304773 | Low resistance contact structures including a copper fill for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-05-28 |
| 10304735 | Mechanically stable cobalt contacts | Keith Kwong Hon Wong, Wonwoo Kim | 2019-05-28 |
| 10269698 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Koichi Motoyama | 2019-04-23 |
| 10269710 | Multi-level metallization interconnect structure | Alexander Reznicek, Oscar van der Straten | 2019-04-23 |
| 10249501 | Single process for liner and metal fill | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-04-02 |
| 10249724 | Low resistance contact structures for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-04-02 |
| 10224281 | Metallic blocking layer for reliable interconnects and contacts | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-03-05 |
| 10211207 | Low resistance source/drain contacts for complementary metal oxide semiconductor (CMOS) devices | Oleg Gluschenkov, Dechao Guo, Zuoguang Liu, Rajasekhar Venigalla, Tenko Yamashita | 2019-02-19 |