| 10503402 |
Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration |
Daniel G. Berger, Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Winfried W. Wilcke |
2019-12-10 |
| 10496309 |
Input/output (I/O) loopback function for I/O signaling testing |
Dean-Dexter R. Eugenio, John R. Goles, Christopher E. Cox |
2019-12-03 |
| 10452602 |
Apparatus for facilitating a connection with an external sensor module |
Qiuhua Hu, Jie Chen, Hua He, Ke Han |
2019-10-22 |
| 10446606 |
Back-side memory element with local memory select transistor |
Joshua M. Rubin |
2019-10-15 |
| 10423877 |
High memory bandwidth neuromorphic computing system |
Charles E. Cox, Harald Huels, Pritish Narayanan, Ahmet S. Ozcan, J. Campbell Scott +1 more |
2019-09-24 |
| 10381452 |
Asymmetric high-k dielectric for reducing gate induced drain leakage |
Anthony I. Chou, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw |
2019-08-13 |
| 10374048 |
Asymmetric high-k dielectric for reducing gate induced drain leakage |
Anthony I. Chou, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw |
2019-08-06 |
| 10367072 |
Asymmetric high-k dielectric for reducing gate induced drain leakage |
Anthony I. Chou, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw |
2019-07-30 |
| 10338701 |
Active brush stylus |
Kunjal Parikh, Jordan E. Maslov, Shantanu D. Kulkarni, Prosenjit Ghosh |
2019-07-02 |
| D847810 |
Computer notebook |
Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N. Larsen, Martin Bone +2 more |
2019-05-07 |
| D846545 |
Computer notebook |
Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N. Larsen, Martin Bone +2 more |
2019-04-23 |
| 10256935 |
Adaptive flexible grid in an optical network |
— |
2019-04-09 |
| 10248591 |
High performance interconnect |
Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more |
2019-04-02 |
| 10243016 |
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment |
Mark C. H. Lamorey |
2019-03-26 |
| 10242906 |
Semiconductor structure with integrated passive structures |
Anthony I. Chou, Renee T. Mo, Shreesh Narasimha |
2019-03-26 |
| 10236317 |
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment |
Mark C. H. Lamorey |
2019-03-19 |
| 10216661 |
High performance interconnect physical layer |
Venkatraman Iyer, Darren S. Jue, Rahul C. Shah |
2019-02-26 |
| 10201312 |
Opportunistic measurements and processing of user's context |
Marisa A. Ahmad |
2019-02-12 |
| 10204909 |
Non-uniform gate oxide thickness for DRAM device |
Simon Ruffell, Tristan Y. Ma, Kyu-Ha Shim, John Hautala, Steven R. Sherman |
2019-02-12 |
| 10204685 |
Ternary content addressable memory |
Igor Arsovski, Suparna Bhattacharya |
2019-02-12 |
| 10192161 |
Lithium-drift based resistive processing unit for accelerating machine learning training |
Babar A. Khan, Yun Seog Lee, Ning Li, Devendra K. Sadana, Joel P. de Souza |
2019-01-29 |
