Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10503402 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2019-12-10 |
| 10461067 | Thermally enhanced package to reduce thermal interaction between dies | Janak G. Patel, Subramanian S. Iyer | 2019-10-29 |