Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10503402 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Daniel G. Berger, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2019-12-10 |
| 10296698 | Forming multi-sized through-silicon-via (TSV) structures | Mukta G. Farooq | 2019-05-21 |
| 10170337 | Implant after through-silicon via (TSV) etch to getter mobile ions | Christopher N. Collins, Mukta G. Farooq, Brian J. Greene, Robert Hannon, Herbert L. Ho +1 more | 2019-01-01 |