Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10503402 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Daniel G. Berger, Troy L. Graves-Abe, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2019-12-10 |
| 10461067 | Thermally enhanced package to reduce thermal interaction between dies | Janak G. Patel, Daniel G. Berger | 2019-10-29 |
| 10262119 | Providing an authenticating service of a chip | Srivatsan Chellappa, Toshiaki Kirihata, Sami Rosenblatt | 2019-04-16 |
| 10176063 | Faulty core recovery mechanisms for a three-dimensional network on a processor array | Rodrigo Alvarez-Icaza Rivera, John V. Arthur, John E. Barth, Jr., Andrew S. Cassidy, Paul A. Merolla +1 more | 2019-01-08 |