Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10503402 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Daniel G. Berger, Troy L. Graves-Abe, Subramanian S. Iyer, Arvind Kumar, Winfried W. Wilcke | 2019-12-10 |
| 10262119 | Providing an authenticating service of a chip | Srivatsan Chellappa, Subramanian S. Iyer, Sami Rosenblatt | 2019-04-16 |