Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438894 | Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices | Koushik Ramachandran, Eric D. Perfecto, Ian D. Melville | 2019-10-08 |
| 10388567 | Thru-silicon-via structures | Fen Chen, Carole D. Graas, Xiao Hu Liu | 2019-08-20 |
| 10296698 | Forming multi-sized through-silicon-via (TSV) structures | Troy L. Graves-Abe | 2019-05-21 |
| 10276461 | Split probe pad structure and method | Ian D. Melville | 2019-04-30 |
| 10242947 | SOI wafers with buried dielectric layers to prevent CU diffusion | Anthony K. Stamper, John A. Fitzsimmons | 2019-03-26 |
| 10215695 | Inspection system and method for detecting defects at a materials interface | Michael Shur | 2019-02-26 |
| 10199315 | Post zero via layer keep out zone over through silicon via reducing BEOL pumping effects | John M. Safran | 2019-02-05 |
| 10170337 | Implant after through-silicon via (TSV) etch to getter mobile ions | Christopher N. Collins, Troy L. Graves-Abe, Brian J. Greene, Robert Hannon, Herbert L. Ho +1 more | 2019-01-01 |