Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242947 | SOI wafers with buried dielectric layers to prevent CU diffusion | Anthony K. Stamper, Mukta G. Farooq | 2019-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242947 | SOI wafers with buried dielectric layers to prevent CU diffusion | Anthony K. Stamper, Mukta G. Farooq | 2019-03-26 |