Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438894 | Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices | Mukta G. Farooq, Koushik Ramachandran, Eric D. Perfecto | 2019-10-08 |
| 10276461 | Split probe pad structure and method | Mukta G. Farooq | 2019-04-30 |
| 10211175 | Stress-resilient chip structure and dicing process | Richard F. Indyk, Shigefumi Okada | 2019-02-19 |