Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211175 | Stress-resilient chip structure and dicing process | Richard F. Indyk, Ian D. Melville | 2019-02-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211175 | Stress-resilient chip structure and dicing process | Richard F. Indyk, Ian D. Melville | 2019-02-19 |