Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438894 | Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices | Mukta G. Farooq, Eric D. Perfecto, Ian D. Melville | 2019-10-08 |
| 10409014 | PIC die packaging using magnetics to position optical element | Benjamin V. Fasano | 2019-09-10 |