Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10460956 | Interposer with lattice construction and embedded conductive metal structures | Jean Audet, Shidong Li | 2019-10-29 |
| 10409014 | PIC die packaging using magnetics to position optical element | Koushik Ramachandran | 2019-09-10 |