Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446484 | Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability | Jochonia N. Nxumalo, Joyce C. Liu, Sami Rosenblatt, Chandrasekharan Kothandaraman | 2019-10-15 |
| 10199315 | Post zero via layer keep out zone over through silicon via reducing BEOL pumping effects | Mukta G. Farooq | 2019-02-05 |