Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446484 | Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability | John M. Safran, Joyce C. Liu, Sami Rosenblatt, Chandrasekharan Kothandaraman | 2019-10-15 |