Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446484 | Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability | John M. Safran, Jochonia N. Nxumalo, Joyce C. Liu, Sami Rosenblatt | 2019-10-15 |
| 10374152 | Magnetic tunnel junction based anti-fuses with cascoded transistors | Anthony J. Annunziata, John K. DeBrosse | 2019-08-06 |
| 10373678 | SRAM margin recovery during burn-in | William V. Huott, Adam J. McPadden, Uma Srinivasan, Stephen Wu | 2019-08-06 |
| 10361093 | Multi time programmable memories using local implantation in high-K/ metal gate technologies | Takashi Ando, Eduard A. Cartier | 2019-07-23 |
| 10355204 | Selective growth of seed layer for magneto-resistive random access memory | Anthony J. Annunziata, Nathan P. Marchack, Eugene J. O'Sullivan | 2019-07-16 |
| 10332591 | SRAM margin recovery during burn-in | William V. Huott, Adam J. McPadden, Uma Srinivasan, Stephen Wu | 2019-06-25 |
| 10211064 | Multi time programmable memories using local implantation in high-K/ metal gate technologies | Takashi Ando, Eduard A. Cartier | 2019-02-19 |
| 10203199 | Strain monitoring of MRAM arrays | Anthony J. Annunziata, Thomas M. Shaw | 2019-02-12 |
| 10168143 | Strain monitoring of MRAM arrays | Anthony J. Annunziata, Thomas M. Shaw | 2019-01-01 |
| 10170697 | Cryogenic patterning of magnetic tunnel junctions | Anthony J. Annunziata, Nathan P. Marchack, Hiroyuki Miyazoe | 2019-01-01 |
| 10170337 | Implant after through-silicon via (TSV) etch to getter mobile ions | Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Brian J. Greene, Robert Hannon +1 more | 2019-01-01 |