Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497862 | Enhanced coercivity in MTJ devices by contact depth control | Gen P. Lauer, Nathan P. Marchack | 2019-12-03 |
| 10475496 | Reduced shorts in magnetic tunnel junctions | Bruce B. Doris, Eugene J. O'Sullivan | 2019-11-12 |
| 10388857 | Spin torque MRAM fabrication using negative tone lithography and ion beam etching | Armand A. Galan, Steve Holmes, Eric A. Joseph, Gen P. Lauer, Qinghuang Lin +1 more | 2019-08-20 |
| 10374152 | Magnetic tunnel junction based anti-fuses with cascoded transistors | John K. DeBrosse, Chandrasekharan Kothandaraman | 2019-08-06 |
| 10355204 | Selective growth of seed layer for magneto-resistive random access memory | Chandrasekharan Kothandaraman, Nathan P. Marchack, Eugene J. O'Sullivan | 2019-07-16 |
| 10256397 | Structure and method to reduce shorting and process degradation in stt-MRAM devices | Gen P. Lauer, Janusz J. Nowak, Eugene J. O'Sullivan | 2019-04-09 |
| 10243138 | Structure and method to reduce shorting and process degradation in STT-MRAM devices | Gen P. Lauer, Janusz J. Nowak, Eugene J. O'Sullivan | 2019-03-26 |
| 10236438 | Multibit self-reference thermally assisted MRAM | Lucian Prejbeanu, Philip L. Trouilloud, Daniel C. Worledge | 2019-03-19 |
| 10203199 | Strain monitoring of MRAM arrays | Chandrasekharan Kothandaraman, Thomas M. Shaw | 2019-02-12 |
| 10183389 | Hammer accessory and associated use thereof | — | 2019-01-22 |
| 10168143 | Strain monitoring of MRAM arrays | Chandrasekharan Kothandaraman, Thomas M. Shaw | 2019-01-01 |
| 10170698 | Spin torque MRAM fabrication using negative tone lithography and ion beam etching | Armand A. Galan, Steve Holmes, Eric A. Joseph, Gen P. Lauer, Qinghuang Lin +1 more | 2019-01-01 |
| 10170697 | Cryogenic patterning of magnetic tunnel junctions | Chandrasekharan Kothandaraman, Nathan P. Marchack, Hiroyuki Miyazoe | 2019-01-01 |
| 10170688 | Magnetic field sensor based on topological insulator and insulating coupler materials | Joel D. Chudow, Daniel C. Worledge | 2019-01-01 |