HH

Herbert L. Ho

IBM: 1 patents #5,496 of 11,143Top 50%
Overall (2019): #448,683 of 560,194Top 85%
1
Patents 2019

Issued Patents 2019

Patent #TitleCo-InventorsDate
10170337 Implant after through-silicon via (TSV) etch to getter mobile ions Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Brian J. Greene, Robert Hannon +1 more 2019-01-01