Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10387339 | High performance interconnect physical layer | Venkatraman Iyer, Jeff Willey, Robert G. Blankenship | 2019-08-20 |
| 10380046 | High performance interconnect physical layer | Venkatraman Iyer, Robert G. Blankenship, Fulvio Spagna, Ashish Gupta | 2019-08-13 |
| 10248591 | High performance interconnect | Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers +18 more | 2019-04-02 |
| 10216661 | High performance interconnect physical layer | Venkatraman Iyer, Rahul C. Shah, Arvind Kumar | 2019-02-26 |
| 10216674 | High performance interconnect physical layer | Venkatraman Iyer, Sitaraman V. Iyer | 2019-02-26 |