Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10480064 | Reaction chamber passivation and selective deposition of metallic films | Delphine Longrie, Antti Niskanen, Han Wang, Qi Xie, Jan Willem Maes +4 more | 2019-11-19 |
| 10468251 | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning | Atsuki Fukazawa, Toshiharu Watarai | 2019-11-05 |
| 10410857 | Formation of SiN thin films | Toshiya Suzuki, Viljami Pore, Shang Chen, Ryoko Yamada, Kunitoshi Namba | 2019-09-10 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Yoshinori Ejiri, Hideo Nakako, Chie Sugama | 2019-07-30 |
| 10201879 | Silver paste composition and semiconductor device using same | Hiroshi Matsumoto, Michiko Natori, Hideo Nakako, Toshiaki Tanaka | 2019-02-12 |
| 10174226 | Adhesive composition and semiconductor device using same | Hideo Nakako, Toshiaki Tanaka, Michiko Natori, Hiroshi Matsumoto | 2019-01-08 |