Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Yoshinori Ejiri, Chie Sugama, Dai Ishikawa | 2019-07-30 |
| 10201879 | Silver paste composition and semiconductor device using same | Dai Ishikawa, Hiroshi Matsumoto, Michiko Natori, Toshiaki Tanaka | 2019-02-12 |
| 10174226 | Adhesive composition and semiconductor device using same | Toshiaki Tanaka, Michiko Natori, Dai Ishikawa, Hiroshi Matsumoto | 2019-01-08 |