Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388608 | Semiconductor device and method for manufacturing same | Kazuyuki MITSUKURA, Masaya TOBA, Kenichi IWASHITA, Kohsuke URASHIMA | 2019-08-20 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Yoshinori Ejiri, Hideo Nakako, Chie Sugama, Dai Ishikawa | 2019-07-30 |